高頻焊簡介
1、Newest Semiconductor Technology: SiC technology with fully digital smart controller
半導(dǎo)體技術(shù):帶全數(shù)字化智能控制器的SiC技術(shù)
2、Wide frequency range: up to 400 kHz that allows a wide range of applications with the same generator
寬廣的頻率范圍:高達400 kHz,允許同一電源的廣泛應(yīng)用范圍
3、Higher efficiency: higher that 99% allowing smaller and simper cooling unit and less OPEX
更高的效率:高達99%以上,允許更小和更簡易的冷卻裝置和更少的運營成本
4、Smaller size and weight: greater maneuverability, less industrial foodplant needed and Very fast replacement of a modules
更小的尺寸和重量:更好的靈活性,更少的工業(yè)布局需要和更方便的模塊更換
5、Full Modular design: Simpler configuration scheme improves stability; easier power maintenance, repairing and upgrading
全模塊化設(shè)計:更簡潔的配置提高穩(wěn)定性;更方便的電源維護、維修和升級
6、Multi-power Port Technology: Single or Multipower power output with dual frequency range
多功率端口技術(shù):單輸出或多輸出電源功率,并允許輸出不同頻率段



