高頻焊簡介

1、Newest Semiconductor Technology: SiC technology with fully digital smart controller

半導(dǎo)體技術(shù)：帶全數(shù)字化智能控制器的SiC技術(shù)

2、Wide frequency range: up to 400 kHz that allows a wide range of applications with the same generator

寬廣的頻率范圍：高達400 kHz，允許同一電源的廣泛應(yīng)用范圍

3、Higher efficiency: higher that 99% allowing smaller and simper cooling unit and less OPEX

更高的效率：高達99%以上，允許更小和更簡易的冷卻裝置和更少的運營成本

4、Smaller size and weight: greater maneuverability, less industrial foodplant needed and Very fast replacement of a modules

更小的尺寸和重量：更好的靈活性，更少的工業(yè)布局需要和更方便的模塊更換

5、Full Modular design: Simpler configuration scheme improves stability; easier power maintenance, repairing and upgrading

全模塊化設(shè)計：更簡潔的配置提高穩(wěn)定性；更方便的電源維護、維修和升級

6、Multi-power Port Technology: Single or Multipower power output with dual frequency range

多功率端口技術(shù)：單輸出或多輸出電源功率，并允許輸出不同頻率段